RVP-550 - B2B貿易平臺 - 王牌供應商

RVP-550

The RVP-550™ vertical thermal flexible batch reactor for 300-mm
wafer processing is designed for process capability and production
requirements for 65 nm and beyond. This system provides single
wafer performance in a batch environment.

Production-proven performance

Leveraging production-proven RVP-300plus software, temperature
control, chemical delivery and wafer transfer technology
Aviza’s fifth generation furnace leveraging the design expertise of
over 2,500 production systems and 40 years of thermal technology
experience

Superior process results targeting 65 nm and beyond

Improved process performance achieved by the use of an isothermal
environment resulting from the proprietary Across-Flow technology
Reduced defectivity through improved process control delivered by
the proprietary plenum design and unique chamber design
Improved uniformity through Aviza’s industry-leading Advanced
Temperature Control (ATC)
Reduced thermal budget and optimized work-in-process (WIP) with
fast temperature ramping
Process flexibility, including low particle DCS Nitride, low
temperature processes such as Satin™ and advanced oxidation, as
well as selective oxide

Low cost of ownership

Increased throughput due to reduced cycle time utilizing dual boat
operation, variable load size, proprietary Across-Flow technology,
fast ramp and NF3 cleans (for LPCVD chambers)
Low consumable usage
Side-by-side configuration to minimize cleanroom footprint