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NextStep Laser Scribing System
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With ever-increasing transistor density, shrinking metal lines and
gate dimensions, producers are forced to use metals of higher
conductivity such as copper, "low-k" isolation materials such
as "black diamond" and more test pads.
These new manufacturing standards set a different threshold for
wafer singulation whereby traditional step cut dicing no longer meets
the quality requirements and cost targets for manufacturing.
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| 公司名稱 |
Advanced Dicing Technologies Ltd
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| 地址
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Advanced Technology Center,Israel
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| 郵政編碼 |
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| 電話 |
97-24-8545222
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| 傳真 |
97-24-8550001
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| 移動電話 |
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| 電子郵箱 |
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| 網站 |
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| 聯絡人 |
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詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613