AWPb 300 Fully Automated Wafer Printing / Bumping System

Milara takes its combined system technology practice one step
further with the development of the new AWPb 300 Wafer Printer /
Bumper system. It is capable of handling 150, 200 and 300mm
wafers with either a dual or single FOUP option. A single robotic arm
with pre-aligner is used to load and unload wafers onto the
automated print stage (EFEM). Utilizing our patented vibration
squeegee technology which has proven viability in wafer bumping,
the AWPb 300 employs the same technology used by all Milara
printers to accomplish ultra fine pitch printing (down to 38um) with
100 percent printing reliability in conjunction with unsurpassed
solder brick geometry.

The AWPb 300, fully automatic robotic wafer bumper offers advanced
technological features and combines them with unprecedented ease
of operation. Windows™ Professional based programming
simplifies every aspect of set-up. A customized windows based
system allows either first time or experienced operators to use the
printer’s full capabilities in just a sort time. The AWPb 300 is
engineered to achieve the highest levels of precision and
consistency in paste deposition. A self-diagnostic program for
instant trouble shooting is built in to ensure maximum productivity.