BGA IC - B2B貿易平臺 - 王牌供應商

BGA IC

Ball-grid arrays (BGA) are IC packages which place output pins in the
form of solder ball matrix. The traces of BGA are generally fabricated
on laminated substrates (BT-based) or polyimide-based films.
Therefore, the entire area of substrates or films can be used to route
the interconnection. BGA has another advantage of lower ground or
power inductance by assigning ground or power nets via a shorter
current path to PCB. Thermally enhanced mechanism (heat sink,
thermal balls, etc.) can be applied to BGA to reduce the thermal
resistance. The sophisticated capabilities make BGA the desirable
package to implement electrical and thermal enhancement in
response to the need for high power and high speed ICs. Compared
with traditional SMT packages, the advantages of BGA are as
follows:
* Higher interconnect density
* Low assembly cost
* Self-alignment during reflow
* Lower profile
* Ease of thermal and electrical management
* Ease of routing