Our aim is to design and manufacture wire bond clamps that help provide optimum wire bonding. Based on leadframe or substrate drawings, samples (if available) and the machine being used, we provide a turnkey solution to these process critical parts. Together with fully CAD-CAM-CNC processing, our aim is quick-turn delivery of optimum bonding.
聯絡我們
公司名稱
Micro-Mechanics
地址
Micro-Mechanics Technology Sdn Bhd Ltd. New Caohejing Tower 509, Cao Bao Road, Unit No. 511 Shanghai,中國大陸
詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613