Surface Profiling System (MP3100 Non-Contact Surface Profiling System)
Automated flat and notch finding for wafer orientation Automated edge locating and bevel angle finding allows for multiple scans at maximum lengths Event logging capability Roughness and waviness measurements in a single scan Recipes/macros can be assigned to programmable funtions keys on the instruments control panel Complete edge and bevel measurement both along and across the wafer Automated multiple scan routines of entire wafer surface area: edge bevel, edge crown, notch (or flat) and both wafer surfaces (front, back) Scan lengths from sub micron to 100mm S2 compliance and CE certification Four levels of operator security
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