The MA300Plus is a highly automated mask aligner platform for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 5 and 100 microns have to be exposed. The MA300Plus represents a new generation of mask aligners from SUSS that are designed to address the requirements of modern high-end fabs in a high volume manufacturing environment.
詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613