Suitable for wafer sizes from 2" to 8" + Unique design that cleans, dries, aligns and pre bonds two wafers in one closed chamber with specific atmosphere + Removes particles >= 0.1µm with high yield and throughput + Smallest Industry Footprint (from 1.2m x 1.4m)
詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613