Chip Bonding Tools

SPT covers a wide range of Chip Bonding Tools, from the time the
silicon chip is picked up from the wafer, and placed on the substrate
or lead frame up to the period where the actual bonding process
takes place. This is where the chips are electrically connected to the
outside world using gold, aluminium or copper wire. Our wide
ranges of Chip Bonding Tools include:
Bonding Capillaries for standard and ultra-fine pitch thermosonic
gold or copper wire bonding
Die Bonding Tools for any die pick and place application
Wedge Bonding Tools for ultrasonic aluminium or gold wire wedge
bonding
Pick up Tools in Ceramic used for Chip Shooters in Surface Mount
Technology SMT assembly