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X-Ray Inspection
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Direct observation/analysis of BGA on the IC pallet. Observation/analysis in all directions with high magnification. Also available rotation and tilting tracking mechanism and automatic positioning mechanism utilizing the latest numerical control technology. |
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| 公司名稱 |
賢昇科技股份有限公司
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| 地址
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敦化南路二段267號14F,台灣
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| 郵政編碼 |
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| 電話 |
886-2-27336377
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| 傳真 |
886-2-27360886
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| 移動電話 |
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| 電子郵箱 |

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