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Dry Scrubber
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Dry Scrubber decomposes PFC generated in a semiconductor process. PFC is a main cause of global warming and ozone layer depletion. Since the World Metrological Organization has decided that PFC be reduced by 20% every year starting 2003, semiconductor makers have secured this equipment. New Power Plasma’s Dry Scrubber uses RTT (RF TCP Type) generating plasma at both the upper and lower levels for the 1st time in the world. Even though it is expensive microwave type and needs a cover, it is safer and cheaper than an explosive burn type in large size and heavy weight. It is a registered Utility model. Taiwan Field Test shows that 99% of CF4 Gas is decomposed. It’s been on a run test for 3 months. Specifications 1. Reactor Volume : 1300ml(Hard Anodized AL & SUS) - Isolator : High Purity Ceramic - Cooling : Water Cooling 2. Plasma Source : Double TCP Type(13.56MHz / 2Kw Max) 3. Process Gas : NF3, C2F6, C3F8, SF6, CF4, CHF3ˇ.. - Total Gas Flow Rate : About 1000SCCM - Mixing Gas : Ar or O2
Application - Semiconductor, FPD(TFT-LCD, etc.) Customer - Samsung, Hynix & LG, Ju-sung Eng
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| 公司名稱 |
Ness Display Co.,Ltd.
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| 地址
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3F Trust tower, 275-7, Yangjae dong, Seocho gu, Seoul, Korea
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| 郵政編碼 |
137-130
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| 電話 |
82-2-5892573
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| 傳真 |
82-2-5892560
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| 移動電話 |
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| 電子郵箱 |

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| 聯絡人 |
Dae-Xiong, Kim / Manager
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