半導體檢測設備<br>(PHEMOS series) - B2B貿易平臺

半導體檢測設備
(PHEMOS series)

Due to the recent trends in chip-design, multi-metal layer, flip chip,
CSP and LOC, backside detection is becoming a necessity in
Emission Microscopy. Obtaining high resolution, high S/N pattern
images is also more important as chip density increases. However,
the conventional method of acquiring pattern images from the
backside through the substrate layer, especially highly doped
substrates, is totally inadequate. PHEMOS-1000 incorporate a IR
Confocal Laser Microscope to obtain high resolution, high dynamic
range pattern image (max. 1024 × 1024) and a cooled CCD camera
with super pixel readout capability or MCT (HgCdTe) or
InGaAsCamera (optional) for IR emission image acquisition. With
the emission image superimposed on a high-resolution pattern
image, the user can pinpoint the exact location of the emission.