EMC - B2B貿易平臺 - 王牌供應商

EMC

DMC (Dongjin Molding Compound)-Series is an electronic material
that effectively protects semiconductors and electronic part devices
from the external environment through the transfer molding process.

Our commercially available products are as follows:

DMC-200 grade;
Improved moldability and reliability.
Designed to improve the package performance on moisture
resistance test through key technologies.
High de-lamination and crack performances are recommended for
surface mounted packages with large-sized die, and even for the
DRAM SOJ and TSOP which require higher moisture resistance test
levels as well as lower die tilt and warpage level.

DMC-800 grade
Designed for BGA and other thermal stability needed packages by
getting the higher cross-linking density of network.
Not only high Tg but also low viscosity properties show good
performances on warpage and wire sweeping of BGA.

DMC-200NF grade
Specially designed to meet higher productivity demands as well as
low cost demands on assembly procedure for the encapsulation of
LSI and VLSI device.

DMC-40 grade
Offers high thermal conductivity by using crystalline silica for discrete
and power device.