Hermetic Lids

Williams Advanced Materials manufactures a variety of hermetic lids
for the semiconductor, hybrid/micro electronics and optical markets.
In the early 1980’s Williams began tack welding its own frames
and lid components together for what has become the traditional
Combo-Lid®. Throughout the years Williams has partnered with
various companies to develop new hermetic lid styles to meet the
changes in packaging designs and sizes.

The Williams hermetic lid product line includes: Micro Lids™ for
packages smaller than .300 square, Seam Seal-Lids™ for sealing
heat sensitive electronics, Solder Reflow-Lids™ , a cost alternative
to the Combo-Lid® and our newest lid, the Visi-Lid™ for optical
packages.

Williams is the leading Combo-Lids® manufacturer in the world with
operations in North America, Singapore and the Philippines in
support of this product line.