Inductively Coupled Plasma (ICP) Etching System<br>(Model RIE-800iPB (High Rate BOSCH)) - B2B貿易平臺

Inductively Coupled Plasma (ICP) Etching System
(Model RIE-800iPB (High Rate BOSCH))

SAMCO's RIE-800iPB is an inductively coupled plasma (ICP) etching
system that uses high-density plasma to perform the deep silicon
etching required by MEMS devices. The system is equipped with a
3kW RF generator and a 2000 liters/sec. TMP.

The RIE-800iPB is specifically designed for the BOSCH process
(licensed from Robert Bosch GmbH) to achieve superior
performance for high-speed deep vertical etching of silicon.

The electrode configuration efficiently generates a stable high-
density plasma, and precisely etches deep silicon structures with a
high degree of uniformity and selectivity.