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From Detection to Decision
(3Di System)
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The 3Di™ Inspection System is specifically designed to fulfill the
most critical need of bumped device manufacturers: timely, accurate
and complete bump data. With patent-pending RCS technology, the
3Di System offers the fastest and most accurate solution for
acquiring important 3D data such as bump height, coplanarity and
other 3D defects, allowing manufacturers of bumped devices to
maintain a competitive edge.
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| 公司名稱 |
Rudolph Technologies, Inc.
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| 地址
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One Rudolph Road P.O. Box 1000 Flanders, New Jersey 07836,VIRGINIS.(US)
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| 郵政編碼 |
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| 電話 |
973-6911300
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| 傳真 |
973-6915480
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| 移動電話 |
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| 電子郵箱 |
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| 網站 |
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| 聯絡人 |
/
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詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613