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Next-gen immersion lithography tool
(NSR-S610C)
The NSR-S610C immersion lithography tool (NA=1.30) utilizes the
“tandem-stage” platform used with the company’s previous-
generation immersion system, which combines a moving wafer-
exposure stage with a dedicated calibration stage. The system uses
a proprietary nozzle design, and an airless fluid handling process
(300ml/min) for water containment instead of an air curtain, which
Nikon claims contributes to evaporation and deforming of the wafer
holder, thus impacting the overlay. The company reports a single tool
overlay specification of <6.5nm and 4.5mλ aberrations in the three-
mirror catadioptric projection lens. Nikon Corp., Belmont, CA; ph
650/413-8533,

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