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Next-gen immersion lithography tool (NSR-S610C)
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The NSR-S610C immersion lithography tool (NA=1.30) utilizes the “tandem-stage” platform used with the company’s previous- generation immersion system, which combines a moving wafer- exposure stage with a dedicated calibration stage. The system uses a proprietary nozzle design, and an airless fluid handling process (300ml/min) for water containment instead of an air curtain, which Nikon claims contributes to evaporation and deforming of the wafer holder, thus impacting the overlay. The company reports a single tool overlay specification of <6.5nm and 4.5mλ aberrations in the three- mirror catadioptric projection lens. Nikon Corp., Belmont, CA; ph 650/413-8533, |
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| 公司名稱 |
microlithography world
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| 地址
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VIRGINIS.(US)Nashua98 Spit Brook Road Nashua, NH 03062-5737
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| 郵政編碼 |
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| 電話 |
603-8910123
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| 傳真 |
603-8910597
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