Memory/Logic Burn-In with Test Systems<br>(LM-1) - B2B貿易平臺

Memory/Logic Burn-In with Test Systems
(LM-1)

Provides burn-in for a variety of device types, including flash memory
devices, DRAMs, SRAMs and high-power and low-power logic
devices.
• Optional individual temperature control for each device under test
up to 20 W.
• ASIC architecture for per-pin timing, testing and formatting.
• Architectural support for efficient generation of complex patterns for
memory array testing.
• Large system capacity of up to 32 burn-in boards.
• 128 digital I/O channels per burn-in board.
• 300 amps of DUT power available per burn-in board.
• Production quantity, hot-only oven.