JetEtch - B2B貿易平臺 - 王牌供應商

JetEtch

Advances in plastic packaging have resulted in complex packages
with very high interconnect densities. The requirements for package
opening become very stringent when such high densities are
incorporated into packages such as micro BGAs and FPBGAs. Other
complex configurations such as multi-die BGAs and Chip Scale
Packages pose unique problems. The encapsulant must be
removed while preserving the integrity of the die, bond pads, bond
wires and leadframe interconnects. To solve these problems,
Nisene Technology Group introduced the JetEtch.

With over 25 years of experience with decapsulation technology, the
Nisene Technology Group JetEtch addresses the ever-changing
needs of the semiconductor industry.

The JetEtch is easy to operate. Intuitive software leads the operator
step by step through the simple programming sequence. Once set,
the software enables an entire etching program to be completed with
only two keystrokes.

The JetEtch is fully programmable and capable of storing multiple
etch programs for different package types.