BGA/CSP Sockets

Designed to Connect to Packages for Burn-in and Test
Accommodating Variations in Package Thicknesses

• Contact Pitches from 0.40mm and 2.54mm

• Direct-Contact Sockets Join Package Solder Balls to
Surface Mount Pads on Board

• Up to 20 Grams Contact Normal Force per Solder Ball
for Reduced Witness Marking assures Good Contact with
High Hertz-force Concentration

• Socket Contact Wipes Diameter of Solder Ball

• Low-Profile and Small Footprint Design Increases Board
Density

• Surface-mount Design Irons Out Coplanarity Issues and
Reduces Need for Extra Board Layers

• Accommodates Ceramic, Plastic Over-molded, Glob Top,
Tape, Metal Heat Sink, Super BGA(CSP) Packages, etc.

• Handler Compatible via Guideplate Adapter Kit