Automated E-beam inspection

Delivers voltage-contrast detection for inline detection of electrical
failures and yield-killing voids.
Provides optimized sensitivity for capturing physical defects down to
50 nm.
Enables inspection of high aspect ratio interconnect (HARI)
structures and detection of defects even at the bottom of vias,
trenches, and interconnects.
Offers ACC™ (Advanced Charge Control, KLA-Tencor's proprietary
technology) for inspection of layers such as dual damascene
copper, low-k, resist, and SOI.
Incorporates KLA-Tencor's IMPACT™ iADC (inline automatic defect
classification) for real-time defect classification, trending by defect
type, and identification of critical excursions and yield-limiting defects.
Enables production-line monitoring and engineering analysis.
Features industry-leading throughput.