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System for Wafer Process
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The resist pattern slimming system realizes the next generation
node device.
High uniformity (Equivalent after lithography)
Independence from pattern density
High aspect ratio pattern is realized
The next generation pattern is realized by conservative technique
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| 公司名稱 |
HITACHI HIGH-TECHNOLOGIES CORPORATION
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| 地址
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24-14,Nishi-bashi 1-chome,Minato-ku,Japan
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| 郵政編碼 |
105-8717
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| 電話 |
81-3-35047155
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| 傳真 |
81-3-35047825
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| 移動電話 |
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| 電子郵箱 |
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| 網站 |
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| 聯絡人 |
/
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詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613