Advanced Cleaning System

Some leading IC manufacturers climb the yield curve faster than
others, and one reason for their success is the ANTARES® System.
The ANTARES® System allows customers to remove defects more
effectively and apply in places not addressable by traditional
methods of particle removal. Typical ROI results in 1 to 3 months.

Particle removal with the all-dry, non-reactive, and brushless
CryoKinetic technology
Safe and effective on sensitive new materials such as Cu and low-k,
unlike wet and scrubber methods that can alter material properties
More effective in particle removal than scrubbers in customer
comparison
Applications:
FEOL and BEOL particle removal

Available configurations:

Fully automated 300mm (bridging to 200mm)
Fully automated 200mm (bridging to 300mm)