Vertical In-line Sputtering System Mini-Line

Universal system for thin film deposition processes in production
and R&D for

PVD (Physical Vapour Deposition ) by rf and dc-sputtering, and
PECVD (Plasma Enhanced Chemical Vapour Deposition)
with pre-treatment facilities by heating and sputter etching.

Electronic components
FPD’s
Solar cells
Others
Design:

The equipment is based upon a modular in-line concept with vertical
substrate handling offering the advantage of processing from both
sides of the substrates simultaneously if requested.

Load lock chamber and processing chamber are separated by a
rectangular valve.

Substrate Source distance is adjustable in order to meet
requirements of different substrate dimension.

A high precision step motor drive enables to run the deposition
processes in different modes. The substrate holder can be rf-
contacted during the movement. The system may be modified
according actual needs regarding productivity, process performance,
in situ process control etc.