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Wafer and Mask Cleaners for Advanced Packaging
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The EVG301 employs one cleaning station, which cleans wafers and
masks using standard DI-water cleaning, megasonic or brush
cleaning procedure. With manual loading and pre-alignment, the
EVG301 is a versatile R&D type system for flexible cleaning
procedures and 300 mm capability.
The EVG301 system can be combined with EVG's wafer alignment
and bonding systems to eliminate any particle prior to wafer bonding.
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| 公司名稱 |
EVG-JOINTECH CORP
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| 地址
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10F-7, No. 400, Hwang-Pei Rd.,台灣
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| 郵政編碼 |
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| 電話 |
886-3-2805680
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| 傳真 |
886-3-2805689
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| 移動電話 |
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| 電子郵箱 |
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| 網站 |
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| 聯絡人 |
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詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613