cost-effective Deep RIE ICP system

At the development stage of complex MEMS components, high
flexibility is required to process different kinds of wafers with a large
variety of materials and constantly changing patterns and designs.

The AMS 100 "I-Speeder" provides a compact, easy operation, cost-
effective solution for process development applications. The AMS
100 "I-Speeder" allows multiple configurations, with minimum
technical intervention. Its design is based on more than 25 years of
plasma processing technology experience, delivering superior etch
performances.

Alcatel's technology leadership has been built on its long-term
experience in deep dry etching of silicon.
With its very high aspect ratio trench etch and profile control
capabilities, the Adixen AMS 100 SE offers the key technology to
meet the specific deep silicon plasma etching requirements of
MEMS designers and manufacturers