DRIE ICP System<br>(AMS 200 'I-Productivity') - B2B貿易平臺

DRIE ICP System
(AMS 200 "I-Productivity")

The new Alcatel AMS 200 “I-Productivity” DRIE tool has recently
been officially presented during Semicon Europa April 4-6th 2006 in
Munich. The optimization of the Bosch process parameters have
shown ultra high Silicon Etch Rate up to 32 µm/min, with unrivaled
uniformity and repeatability leading to excellent process yields. In
parallel, most recent hardware and proprietary design improvements
including vacuum pumping lines, process chamber, wafer chucks,
pressure control system, gas delivery optimization have been
monitored in a mass production environment. Field data analysis
show a significant reduction of cost of ownership thanks to
increased throughput and much lower running costs.

The latest developments applied to the Alcatel AMS 200 “I-
Productivity” result in much higher production performances,
thanks to lower etch drift, extended cleaning frequency, limited edge
exclusion, higher etch rate, better process stability and higher etch
uniformity. It is now possible to offer an unrivaled set of hardware
and process solutions, using AMS 200 “I-Productivity” DRIE tools
for high volume manufacturing, applied to 3D-SiP and MEMS.
The typical etched patterns include tapered trenches for image
sensors, through silicon via holes, controlled profile angle for 3D
high precision inertial sensors, large exposed area features for
inkjet printer head and Silicon microphones.