These machines and solutions are utilized in what is known as the backend segment of semiconductor production. The core business of Assembly Equipment encompasses die attach (Esec Die Bonders and Esec Flip Chip Bonders) and wire bonding. Unique know-how in the area of mechatronics, highly qualified employees, intensive cooperation with suppliers, and a global network of sales organizations (Customer Support Centers) are the key factors in the company’s success
產品服務:
封裝
貿易類型:
制造商
OEM 服務:
No
採購或供應商:
供應商
市場位置:
工廠位置:
工廠大小
(平米):
員工人數:
501 - 1000
開發人數:
年銷售額 (美元) :
USD 1,000,001 - 2,000,000
成立年份:
1991
法人代表/CEO:
聯絡我們
公司名稱
Oerlikon (Shanghai) Co. Ltd
地址
Fu Te Dong San Road No.76, 33# Building Waigaoqiao Free Trade Zone Shanghai,中國大陸
詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613