Achievements in pass 13 years 1991 Set-up of Company, mass-production of sports materials and accessories 1992 Mass production of packing tray of QFP28x28, QFP14x20 of JEDEC specifications 1996 Mass production of IC packing tray of MQFP14x20, BGA35x35, BGA27x27 JEDEC SPCIFICATIONS 1997 Mass production of IC packing tray of TQFP14x20 JEDEC SPECIFICATIONS 1998 Mass production of IC packing tray of TSOP TYPEI and TYPEII JEDEC specifications 1999 Mass production of CSP(chip scale package) IC packing tray 2000 Received patent Design Authorization for IC packing tray of R.H.MURPHY BGA JEDEC specifications 2001 Mass production of embossed carrier tape 2002 Mass production memory card
詢盤籃
幫助
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604292613