鼎芯通訊(上海)有限公司於2002年創立於上海浦東張江高科技園區﹐是中國第一家專注於手機射頻與混合信號SoC（全系統單晶片）的積體電路晶片設計企業。公司的初始產品包括基於CMOS技術的驅動各類移動終端和便攜個人數碼平臺的射頻積體電路收發器晶片。 公司主要投資方包括英特爾創投（Intel Capital）以及國際半導體業界的數位領軍人物。 鼎芯的核心技術人員是一批在射頻積體電路領域有著多年技術開發和管理經驗的高科技人才。公司團隊現共計70餘人﹐70％具有碩士和博士學位﹐80％為研發工程技術人員﹐57％為晶片設計人員﹐其中具有“海歸''背景的高端人才佔18％。經過幾年的積累和發展﹐鼎芯已經培養出一支大中國地區最具產業化經驗的､完整的本土化高端晶片設計技術團隊。 自創立至今﹐鼎芯率先於2004年底開發出了中國第一顆完整射頻收發器並於2005年成功產業化（“中國射頻第一芯''）。2005年中以來承擔了中國3G “TD-SCDMA產業化''國家專項﹔2007年2月在頂級國際技術峰會“國際固態電子電路大會''（ISSCC）上發佈了“世界上第一顆CMOS TD-SCDMA''射頻晶片。這是被譽為“晶片設計奧運會''的ISSCC五十四年歷史上第一次發佈來自中國的完整核心晶片。鼎芯CEO因上述成績和“抓住了發展中國自主3G標準──TD-SCDMA的良好契機﹐建立起國內具有產業化經驗的射頻設計技術､市場和管理團隊﹐為中國TD-SCDMA產業鏈的晶片短板──射頻領域﹐填補了關鍵的核心技術空白﹐打破了國外晶片廠商的壟斷局面''而在“2006中國訊息產業經濟年會''上入選十大“2006中國訊息產業年度新銳人物''。 Established in 2002 at Zhangjiang Hi-tech Park of Pudong, Shanghai, Comlent is the 1st RFIC design house in China focusing on handset RFIC and mixed-signal SoC chipset solutions. Products of Comlent nowadays include RF transceivers in CMOS technology for mobile phones and portable digital mobile devices, etc. Investors of Comlent include Intel Capital and leaders in semiconductor industry worldwide. The core team members of Comlent are semiconductor professionals with years of RFIC R&D experience and management experience. The company has over 70 employees, 70% of which have master or Ph.D. degrees, 80% are engineers, and 57% are IC designers, 18% of which have oversea employment experience. As a result of company development in these years, Comlent has built a team with real industry mass production experience and high-end design experience in Greater China, which covers the whole design, production and application cycle for RFIC products. Comlent launched China’s 1st RF transceiver (remarked “The first Radio Frequency Chip in China'' by media and industry) at the end of 2004 and commenced its mass production in 2005. From the middle. of 2005, Comlent was designated to take a TD-SCDMA commercialization project, an ad hoc one supported by national funds.
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