ASMPT於1975年建立,是全球最大的面向半導體產業的集成和封裝設備提供商。我們所生產的半導體集成設備和材料(蝕刻式以及衝壓式引線框架)為跨國晶片製造商、獨立積體電路(IC)裝配工廠和電子工廠服務。ASMPT於1989年在香港上市,目前有54%的股份由ASM International N.V. 所有。而ASM International N.V. 是納斯達克榜上有名的晶圓過程設備提供商。
ASM Pacific Technology Ltd. was founded in 1975. We are the world's largest assembly and packaging equipment supplier for the semiconductor industry. We manufacture semiconductor assembly equipment and materials (etched and stamped leadframes) used by multinational chip manufacturers, independent IC assembly houses and consumer electronics manufacturers. Listed in Hong Kong since 1989 (ASMPT), ASM Pacific Technology Ltd. is 54% owned by ASM International N.V., a NASDAQ listed supplier of wafer processing equipment.
In 2002, when all leading assembly and packaging equipment competitors were experiencing revenue decline and profit losses, ASM Pacific Technology Ltd. outperformed our industry peers, displacing the perennial industry leader to become number one in the assembly and packaging equipment industry. Apart from our continuously growing market share, we have also distinguished ourselves from our peers with our consistent profitability and high returns to our shareholders. In addition to establishing our leadership position with a broad product range, we have built a diversified customer base in both geographically and technologically different markets to limit our risks. We have continued our strong commitment to research and product development with support from over 550 staff in our Hong Kong and Singapore R&D centers.
Eagle60 wire bonder, die and flip chip bonders are our new products.
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