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Orthodyne Electronics Corporation
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Where We've Been
In 1962, two talented engineers, Michael and Hal Smith, started a company to design and market ultrasonic generators and transducers. Their initial products were radio frequency attenuators for signal generators and an ultrasonic drill, used on hard, brittle materials such as glass and ceramics. Using the same techniques as in the drill, the brothers used ultrasonic energy for connecting wires in transistor assemblies. In the ensuing years, the company developed a manual wire bonder, and eventually the first fully automated wire bonders for power transistor assembly.
Where We're Going
Today, Orthodyne Electronics is the leading manufacturer of ultrasonic wire bonders, with an established tradition of developing revolutionary products for the semiconductor and microelectronics industries. As chip technology evolves into smaller and more powerful components, the need grows for increasingly sophisticated connection techniques.
Core technologies
Orthodyne's products are based on multiple core technologies, including ultrasonics, machine vision, and high speed robotic mechanisms. With these core technologies and resources under one roof, our R&D teams can put systems together to meet our customers' changing needs. In a dynamic industry, our close contact with customers allows us to anticipate and accommodate industry changes and new requirements. | |
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| 公司名稱 |
Orthodyne Electronics Corporation
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| 地址
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USA16700 Red Hill Avenue, Irvine, CA
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| 郵政編碼 |
92606-4802
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| 電話 |
1-949-6600440
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| 傳真 |
1-949-6600444
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詢盤籃
幫助
ace_suppliers@hotmail.com 
604292613