華邦電子於1987年創立於新竹科學園區﹐1995年正式於臺灣證券交易所掛牌上市 (華邦電﹕2344)﹐多年來在產品設計､技術研發､晶圓製造､及用戶關係的領域努力深耕﹐在半導體產業樹立起厚實的格局與信譽。 華邦以兩大事業群－「邏輯產品事業群」及「記憶體產品事業群」為核心。邏輯產品事業群專注於以微控制器為主的消費性產品及計算機邏輯產品兩大領域﹔記憶體產品事業群掌握行動記憶體與閃存關鍵技術﹐其主要產品包括低功率動態隨機存取記憶體､利基型動態隨機存取記憶體､類靜態隨機存取記憶體､標準型記憶體以及低密度閃存等﹐各產品線間緊密的互補性與綜效性﹐提供完備的客需服務供應網路。 目前華邦擁有一座十二呎晶圓廠､二座八呎晶圓廠(注)､及一座六呎晶圓廠﹐全球員工共計超過五千名﹔華邦重視與用戶及合作夥伴的長期關係﹐在美國､中國大陸､日本及以色列等地均設有據點﹐強化地區性用戶支援服務與全球運籌管理﹔累積豐厚智慧與經驗的華邦團隊﹐取得各國專利超過二千五百件﹐追求卓越與創新是我們未來持續努力的目標﹔在品質方面﹐透過嚴格的生產流程控制與品管作業﹐強化良率分析､供應鏈管理與用戶滿意度之成效﹐亦獲得IECQ､ISO9001､ISO14001及QS9000國際品質認證的肯定。 華邦以「擔當､創新､群效」之工作文化展現企業風範﹐透過傳遞核心價值觀於各項經營活動之中﹐達成公司策略目標﹔華邦傳遞科技於工作､生活及娛樂各項活動範疇之中﹐以提昇人類工作效率與生活樂趣為公司主要宗旨。 Winbond Electronic Corp. was founded in 1987 in the Hsinchu Science Park, Taiwan. The Company has been publicly traded on the Taiwan Stock Exchange (stock code﹕2344) since 1995. Cultivated in the fields of product design, research and development in technologies, manufacturing and customer relationship over years, Winbond has attained a solid foundation and reputation in the semiconductor industry. Winbond has two business groups - Logic IC Business Group and Memory IC Business Group. The Logic IC Business Group focuses on two specific sectors including μc & μc-based consumer products and computer logic products. The Memory IC Business Group is dedicated to technological development of Mobile RAM and Flash Memory, and its major products include Low Power DRAM, Specialty DRAM, Pseudo SRAM, Commodity DRAM, and low-density Flash etc. The integration and synergy of all product lines create a complete supply service network for customers. Winbond currently operates a 300mm wafer fab, two 200mm wafer fabs('') and a 150mm wafer fab. The company has over 5,000 employees worldwide. Winbond values its customers and long-term partnership, therefore has subsidiaries in Mainland China, America, Japan and Israel to strengthen its regional customer support as well as global management. Through the collaboration of its experienced and intelligent engineerin
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